What’s in the October Issue?

Each issue of Semiconductor Digest has articles found only in the magazine! Read the October issue…

Bridging Optics and Electronics

Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences, in collaboration with a team from Washington University, have developed a simple spatial light modulator made from gold electrodes covered by a thin film of electro-optical material that changes its optical properties in response to electric signals.

Intelligent Optical Chip to Improve Telecommunications

An INRS team uses autonomous learning approaches for optical waveform generators to boost optical signal processing functionalities for current and future telecom applications.

What’s in the October Issue?

Each issue of Semiconductor Digest has articles found only in the magazine! Read the October issue…

Veeco Receives Multi-System Order for New, Dual-Technology Platform that Enables Next Generation Power Electronic Devices

Veeco Instruments Inc. announced today that it has received a multi-system order for its new ADS-800 SRD System from a leading semiconductor supplier.

IBM Commits to Skill 30 Million People Globally by 2030

 IBM  today unveiled a groundbreaking commitment and global plan to provide 30 million people of all ages with new skills needed for the jobs of tomorrow by 2030. 

Imec Signs Licensing Agreement with miDiagnostics to Commercialize its Patented Technology for Fast and Reliable COVID-19 Diagnosis Based on Exhaled Breath

Imec and miDiagnostics announce that they have signed a non-exclusive licensing agreement for imec’s patented technology whereby aerosols and droplets from exhaled breath are captured for screening for viral RNA through miDiagnostics ultrafast PCR technology.

IC Industry at Heart of Possible China Takeover of Taiwan

Combined, China and Taiwan would hold about 37% of global IC capacity, almost 3x that of North America.

The Worldwide Quantum Dot Industry is Expected to Reach $8.6 Billion by 2026

The global quantum dot market is estimated to be worth USD 4 billion in 2021 and is projected to reach USD 8.6 billionby 2026, at a CAGR of 16.2%.

NEXTY Electronics to Distribute Blaize AI Edge Computing Products in Japan

Blaize, the AI computing innovator revolutionizing automotive and edge computing, and NEXTY Electronics Corp., a core member of the Toyota Tsusho Group, today announced NEXTY is now a Blaize distribution partner serving automotive and industrial markets for AI edge computing in Japan.

Panasonic Launches Novel Substrate Film Enabling the Development of Soft Printed Electronics

Leveraging patented thermoset polymer technology, Panasonic researchers have developed BEYOLEX, a pliable, yet durable, stretchable substrate for printed electronics and other applications.

STMicroelectronics and Sierra Wireless Collaborate to Simplify and Accelerate Connected IoT Solutions Deployment

STMicroelectronics and Sierra Wireless, an IoT services provider, have announced an agreement that will enable the STM32 microcontroller (MCU) user community to leverage flexible cellular IoT connectivity and edge-to-cloud solutions from Sierra Wireless.

Power and Compound Fab Capacity Projected to Top Record 10 Million Wafers Per Month in 2023, SEMI Reports

Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions wrought by the pandemic, worldwide installed capacity for power and compound semiconductor fabs is projected to top 10 million wafers per month (WPM) for the first time in 2023, growing to 10.24 million WPM (in 200mm equivalents) and climbing to 10.6 million WPM in 2024, SEMI announced today.

Rambus Advances Server Memory Performance with the Industry’s First 5600 MT/s DDR5 Registering Clock Driver

Rambus Inc. (NASDAQ: RMBS), a chip and silicon IP provider making data faster and safer, today announced it is now sampling its 5600 MT/s 2nd-generation RCD chip to the major DDR5 memory module (RDIMM) suppliers.

SkyWater Signs Technology Transfer and License Agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology

SkyWater Technology, the trusted technology realization partner and Deca Technologies(Deca), a provider of advanced electronic interconnect technology, today announced an agreement for Deca’s second generation M-Series fan-out wafer-level packaging (FOWLP) technology with Adaptive Patterning within SkyWater’s advanced packaging facility in Florida.

Semtech Launches Upgraded LoRa Developer Portal

Semtech Corporation, a global supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced the upgraded launch of the LoRa Developer Portal, which makes it easier for developers, regardless of experience level, to quickly build Internet of Things (IoT) devices connected with the LoRaWAN standard.

New Nanostructure Could Be the Key to Quantum Electronics

Using a completely new synthesis approach, nanostructures made of aluminium single crystals and the semiconductor germanium are jointly explored at TU Wien and CNRS-UGA Grenoble for future quantum technologies.

Contributing to Solve the Heat Concentration Problem in Power Semiconductors

In high-performance CPUs used in large servers and power semiconductors used in inverters for hybrid electric vehicles (HEVs), as the integration density rises and the higher the power consumption becomes, the semiconductor package is also becoming smaller.

2021 IEDM to Unveil the Latest Advances in Semiconductors and Related Technologies

The foundational elements of digital technologies – semiconductors and other micro/nanoelectronic devices – have become indispensable to modern life, and the place to learn about cutting-edge research in the field is the 67th annual IEEE International Electron Devices Meeting, to be held December 11–15, 2021 at the Hilton San Francisco Union Square hotel.

AI Chipmaker Hailo Raises $136 Million to Expand Edge AI Solutions as Global Demand Surges

AI chipmaker Hailo today announced it has raised$136 million in a Series C funding round led by Poalim Equity and Gil Agmon.

Alif Semiconductor and Arm Announced Record-Breaking Power Efficiency Breakthrough for Edge Node AI/ML Workloads

Measurements on Alif’s Ensemble MCU show a 76x increase in power efficiency per inference for image classification vs. Cortex-M55 alone, and 800x uplift in performance as compared to previous generation Cortex-M CPU cores.

Samsung Starts Mass Production of Most Advanced 14nm EUV DDR5 DRAM

Samsung Electronics Co., Ltd. today announced that it has begun mass producing the industry’s smallest, 14-nanometer (nm), DRAM based on extreme ultraviolet (EUV) technology.

xMEMS Announces World’s First True MEMS Speaker, Montara, Is Now in Production

xMEMS Labs today announced the production of the world’s first monolithic MEMS µspeaker, Montara. Working closely with TSMC, the semiconductor foundry, Montara has passed all required performance and reliability qualifications.

Engineers 3D-Print Personalized, Wireless Wearables That Never Need a Charge

The new devices, custom made to fit individuals, could mean massive improvements in the monitoring and treatment of diseases, the testing of new drugs and the ability to track personal health.

Aehr Receives $1.3 Million Order for FOX-NP Test & Burn-in Systems for Photonics Device Characterization and Product Qualification

Aehr Test Systems, a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has received a $1.3 million order from a current customer for two FOX-NP systems, adding to their existing fleet to provide additional test capacity for new product engineering characterization and qualification of photonics devices.

Brooks Instrument Pressure-based Mass Flow Controllers - Theory of Operation

Meet the Brooks Instrument pressure-based mass flow controller (P-MFC) that can HANDLE the PRESSURE, the GP200 Series.

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